| 摘要 |
PURPOSE:To enable the use of an insoluble electrode and to eliminate the stop of a plating line by the exchange of an electrode by combinedly supplying copper oxide and copper sulfate to a copper sulfate plating bath. CONSTITUTION:A copper sulfate plating bath L filled into a plating tank 11 is allowed to overflow the tank 11, all of the bath is recovered in a storage tank 16, and the bath is circulated to the tank 11 with a pump 15. A long-sized beltlike material S to be plated is horizontally fed into the space between electrodes 13, 14 placed horizontally at the upper part of the tank 11. The material S is plated with copper in the copper sulfate plating bath L contg. about 200g/l copper sulfate and about 50g/l sulfuric acid while copper oxide and copper sulfate are supplied to the bath in 3:1 weight ratio.
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