| 摘要 |
<p>PURPOSE:To obtain a plated-type thermal head showing favorable adhesion between heating elements and a thermal recording paper, by a method wherein a polyimide layer is provided on a substrate so that a polyimide is present only at pattern parts, Pd is provided on the polyimide layer by using a Pd- donative liquid, and a resistor layer is provided by electroless plating. CONSTITUTION:The polyimide layer 12 is provided on the ubstrate 11 only at the pattern parts. On the entire surface of the substrate 11, Pd is provided by using a Pd-donative liquid showing a special adsorptivity to polyimide. Electroless plating is then conducted to deposit a metal on the polyimide layer 12 provided with Pd, thereby providing a patterned resistor layer 13. Photolithography is conducted to cover the parts of the layer 13 to become heating elements, followed by electroplating to provide a wiring layer 14 on the resistor layer 13 except the parts to be the heating elements. After removing the resist, a protective film 15 is provided on exposed parts (the parts to be the heating elements) of the resistor layer 13. Accordingly, the heating elements are made to be protuberant in shape, to a degree corresponding to the thickness of the polyimide layer.</p> |
