| 摘要 |
PURPOSE:To obtain the titled composition of high moisture and heat resistance, useful for semiconductor device sealing, etc., by blending epoxy resin, curing agent and specific ingredient containing organometallic compound. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin (pref. of glycidyl ether base), (B) a curing agent and (C) an ingredient comprising (i) one or two kinds of organometallic compounds selected from organoaluminum-, organotitanium-, organozirconium-, organotin-, organolead-, organozinc- and organochromium compounds, (ii) either or both of lanolin and its derivative, and (iii) an organosiloxane compound having one or more kinds of groups selected from hydroxyl group, alkoxy groups directly bonded to silicon atom and hydroxyl group directly bonded to silicon atom. The blending ratios are pref. such as to be 0.01-5wt%, 0.1-10wt% and 0.01-5wt% for the components (i), (ii) and (iii), respectively, each based on the component (A).
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