| 摘要 |
PURPOSE:To incorporate an electronic part preferably by coping with the incorporation of the electronic part so that the surface of the electronic part is brought to a specification by trimming the surface of the electronic part before incorporation. CONSTITUTION:A series of electronic parts 1 not rated are extracted in succession by a transfer section 20 and transported up to the position of trimming, trimmed and treated completely, and transferred up to the position of a substrate 3 to be incorporated. The values of the electronic parts 1 during trimming are detected as a command value previously determined for the electronic parts 1 in order to trim the electronic parts at the position of the trimming, and a trimming treatment means is controlled so that a deviation between the command value and a detecting value reaches a permissible value. One part of a filmy resistance section is removed by laser beams and a resistance command value is obtained in trimming treatment on a resistor as the electronic part not rated, and one part of a tabular electrode is removed by laser beams and an electrostatic capacitance command value is acquired in trimming treatment on a capacitor. |
