| 摘要 |
PURPOSE:To make a bare chip replasable by fixing the bare chip on a substrate with heat-plastic adhesive so as to melt the adhesive with reheating. CONSTITUTION:A conductive layer 2 with desired pattern is printed on a ceramic wiring substrate 1, and heat-plastic adhesive 3 is printed on the section where the chip is to be attached. Then a bare chip 4 is placed on the adhesive 3, and the adhesive 3 is heated with a heater 5 to fix the bare chip 4 on the wiring substrate 1. A wire 6 is spread between the electrode of the bare chip 4 and the specified conductive layer 2. Then, a probe needle 4 is contacted with the conductive layer 2 to inspect the characteristics. The bare chip 4 proved to be defective is partially heated with a small heater to melt the adhesive 3. Then, the bare chip 4 is replaced. |
