发明名称 RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve reliability under the state of a high temperature and high humidity by making a polyfunctional epoxy compound and a bis-imide amine group compound represented by a specific chemical formula as a curing agent to be contained in a resin composition. CONSTITUTION:A polyfunctional epoxy compound and a bis-imide amine group compound represented by a specific chemical formula I (in formula, R1 and R2 are either of a specific chemical formula II, and R1 and R2 may be the same or different) as a curing agent are made to be contained in a resin composition. Various inorganic substances and addition agents can be compounded and used as the resin composition in response to objective and application. Accordingly, reliability under the state of a high temperature and high humidity is improved.
申请公布号 JPS61269342(A) 申请公布日期 1986.11.28
申请号 JP19850110410 申请日期 1985.05.24
申请人 HITACHI LTD 发明人 NISHIKAWA AKIO;ABE HIDETOSHI;OGATA MASAJI
分类号 C08G59/00;C08G59/40;C08G59/50;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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