发明名称 RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve reliability under the state of a high temperature and high humidity by compounding a two-functional epoxy compound represented by a specific chemical formula to a resin composition. CONSTITUTION:A two-functional epoxy compound represented by a specific chemical formula (in formula, R represents either of H or CH3 and m 1-4) is compounded to a resin composition. Substances, such as the powder of calcium carbonate, silicate, etc. and a short fiber-shaped filler, a mold release agent, a coupling agent and a flame retardant are added to the resin composition in response to the application of the composition and the object of use thereof. Accordingly, reliability under the state of a high temperature and high humidity is improved.
申请公布号 JPS61269341(A) 申请公布日期 1986.11.28
申请号 JP19850110409 申请日期 1985.05.24
申请人 HITACHI LTD 发明人 NISHIKAWA AKIO;OGATA MASAJI
分类号 C08G59/00;C08G59/02;C08G59/20;C08G59/24;H01L23/29;H01L23/31 主分类号 C08G59/00
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