| 摘要 |
PURPOSE:To hold and protect each LSI chip by a mechanism part, to eliminate trouble even when there are a quantity of mechanical stress and to dissipate heat excellently by mounting the mechanism part to a wiring substrate so that the LSI chips are held to the wiring substrate. CONSTITUTION:A wiring 12 for connections, input-output pins 11 and electrodes 13 for bonding are fitted to a wiring substrate 1. An LSI chip 3 has leads 31 conducting bonding and connections with the electrodes 13 for the wiring substrate 1, the LSI chip 3 is loaded to the wiring substrate 1 in a face-down manner, and terminals 32 for the LSI chip 3 are bonded with the electrodes 13 for the wiring substrate 1 through the leads 31, thus forming electric connections. A protective cover 2 is made of a material having excellent thermal conductivity, four corners thereof have legs 21, the cover 2 is joined with thermal conductive adhesives or solder or the like so as to cover the back of the LSI chip 3, and the legs 21 are bonded or soldered and fixed to the wiring substrate 1, and the cover 2 is mounted so that the LSI chip 3 is held to the wiring substrate 1. |
