发明名称 |
APPARATUS FOR COATING ADHESIVE |
摘要 |
<p>PURPOSE:To make it possible to surely adhere electronic parts while prescribing the adhesion amount of an adhesive to a predetermined amount, by providing a convexed projection to the leading end of a coating pin for applying an adhesive to a printed circuit board. CONSTITUTION:A coating pin 12a is lowered in the direction shown by an arrow A and rise after adhering the adhesive 13 on an adhesive supply apparatus 3. At this time, the surface tension of the adhesive 13 acts on a projection 15 to make the amount of the adhesive 13 constant. When the adhesive 13 is applied to a printed circuit board in this state and electronic parts is transferred to said board to be adhered thereto, electronic parts can be stably mounted on the board to which a required amount of the adhesive 13 is constantly applied in such a state that the adhesive is slightly protruded or is not quite protruded.</p> |
申请公布号 |
JPS61268375(A) |
申请公布日期 |
1986.11.27 |
申请号 |
JP19850107488 |
申请日期 |
1985.05.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HIDESE WATARU;KIDACHI TETSUHIRO |
分类号 |
H05K3/34;B05C1/02;B05C5/00;H05K3/30 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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