发明名称 THERMAL SPRAYING JIG OF PATTERN FOR SEMICONDUCTOR
摘要 PURPOSE:To surely hold objects for thermal spraying and to improve productivity by fixing permanent magnets into a support contg. the objects for thermal spraying and adopting a manetically excitable material for a mask. CONSTITUTION:Recesses 3 are formed to the supporting plate 1 which is a thick Al plate, etc. The permanent magnets 2 are embedded and fixed into the recesses 3. The objects for thermal spraying such as Al plates 4 are prepd. and are imposed in the recesses 3 of the plate 1 into which the magnets 2 are fixed. A mask material 5 which is an iron plate or the like formed with the holes having the outside diameter similar to the outside diameter of the objects for thermal spraying, i.e., the Al plates 4 is superposed on the plate 1. A plasma spraying stage is started by such method to deposit a thermally sprayed insulating layer 6 on the plates 4 and thereafter a conductive pattern 7 is formed thereon. The objects for thermal spraying such as plates 4 are securely fixed by using the above-mentioned jig. The thermally sprayed layer is deposited only on the mask material 5. The thermal spraying is thus made possible without staining other tools.
申请公布号 JPS61266562(A) 申请公布日期 1986.11.26
申请号 JP19850108238 申请日期 1985.05.22
申请人 TOSHIBA CORP 发明人 NAGASHIMA KENJI;SEKIBA TOSHINOBU;OMORI KAZUSHI
分类号 H01L21/683;C23C4/00;C23C4/02;C23C4/12;H01L21/67;H01L23/12;H01L25/07 主分类号 H01L21/683
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