发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To decrease the occurrence of poor connection by a method wherein bumps provided with stripe-geometry protrusions and recesses on their upper surfaces are positioned facing each other with the protrusions and recesses intertwined. CONSTITUTION:A bump 3a is approximately 30mum in diameter and approximately 10mum in height. A stripe-geometry protrusion/recess 4 has a rectangular cross section. A protrusion is approximately 5mum in width. A recess is approximately 5mum in width and approximately 4mum in depth. Of the entirety, at least the protrusions/recesses 4 are formed of in. Accordingly, when pressure is applied with a protrusion accommodated in a recess, they collapse to be tightly combined. This ensures easy contact for a bump 3a to come into contact after the collapse, which ensures excellent contact for all the bumps 3a.
申请公布号 JPS61267349(A) 申请公布日期 1986.11.26
申请号 JP19850109607 申请日期 1985.05.22
申请人 FUJITSU LTD 发明人 MAEKAWA TORU
分类号 H01L21/60 主分类号 H01L21/60
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