| 摘要 |
PURPOSE:To contrive to enhance humidity resistance and to enhance thermal shock resistance of a lead frame by a method wherein grooves to cross respective leads are formed to the resin sealing parts of tab leads supporting a bed frame and to inner leads, and recess parts of the plural number to scatter thermal stress are formed on the under surface of the bed frame. CONSTITUTION:A bed frame 6 is supported by inner leads 7 and tab leads 9 continuously connected from the same direction, and grooves 10 to cross the respective leads are formed on the top surfaces and the under surfaces of the tab leads 9 thereof and the respective inner leads 7. Because of formation of the grooves 10, stresses to act on the boundaries between the respective leads and molding resin are complicated, adhesion between molding resin and the respective leads is enhanced, and a transfer of water at the boundary can be suppressed. Recess parts 12 of the plural number are formed on the under surface of the bed frame 6. Accordingly, thermal stress to be generated to the boundary between the bed frame 6 and molding resin 4 is reduced, and the coefficient of generation of a crack can be reduced. |
