发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:The titled composition of excellent moldability which can be obtained by a simplified production process, comprising a specified polymerizable thermosetting polyamide-imide and a specified unsaturated N,N'-bisimide. CONSTITUTION:A tricarboxylic acid (e.g., trimellitic acid) or its functional derivative of the same reactivity is reacted, by heating, with a diamine (e.g., m-phenylenediamine) and further reacted with a polymerizable unsaturated dicarboxylic acid anhydride (e.g., Nadic anhydride) or its functional derivative of the same reactivity, a dicarboxylic acid or the like to obtain a polymerizable thermosetting polyamide-imide (A) of formula I (wherein R is a 2C or higher bivalent organic residue having at least one polymerizable double bond, T is a trivalent aromatic group, D is a bivalent aromatic group and n and m are each >=1). Before or after the reaction for obtaining component A is complet ed, an unsaturated N,N'-bisimide of formula II (wherein X is a bivalent group containing a C=C double bond and Y is a 1C or higher bivalent organic group) is melt-mixed with the component.
申请公布号 JPS61266419(A) 申请公布日期 1986.11.26
申请号 JP19850108356 申请日期 1985.05.22
申请人 TORAY IND INC 发明人 ITO HIDEO;TANIGUCHI MASAHARU;MINAMI SOKO
分类号 C08G73/00;C08F20/00;C08F20/52;C08F22/36;C08F222/40;C08G73/12 主分类号 C08G73/00
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