发明名称 Semiconductor wafer precision cutting device with integrated compensators to reduce errors caused by temperature changes.
摘要 <p>A precision device comprising a holding means (86) for holding an object and a supporting means (4, 6, 8, 10) for supporting an operating element (48), one of which is movable in a predetermined direction. The precision device includes a detecting means (52, 54) for detecting the amount of movement of one of the holding member (86) and the supporting member (10) in said predetermined direction, and the detecting means (52, 54) includes a scale (58, 68) formed of a material having a coefficient of linear expansion, in a temperature range of -20 to 100°C, of not more than 10 x 10 7/1Cas an absolute value. The precision device further comprises a detecting means (76, 80, 84) for detecting the amount of thermal expansion of at least a part (10) of the supporting means in said predetermined direction.</p>
申请公布号 EP0202630(A2) 申请公布日期 1986.11.26
申请号 EP19860106728 申请日期 1986.05.16
申请人 DISCO ABRASIVE SYSTEMS, LTD. 发明人 SEKIYA, SHINJI
分类号 B23D59/00;B23Q11/00;G01B5/00;G05B19/404 主分类号 B23D59/00
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