发明名称 REMOVAL OF ORGANIC FILM
摘要 PURPOSE:To remove the organic film to be formed on the surface of the substrate in a short time by a method wherein mixed gas of at least either of hexafluoroethane gas and trifluoromethane gas and oxygen gas is fed to the plasma-generating chamber. CONSTITUTION:A treating chamber 1 is blocked in the top of its cylindrical main body 2 with a quartz glass 3 and a thin external electrode 5 to be connected to a high-frequency oscillator 4 is fixed on the surface of the top of the quartz glass 3. Moreover, a placing stand 6 for a substrate W is airtightly fitted into the bottom part of the cylindrical main body 2, a thin internal electrode 7, whereon numerous small holes (a)... are formed, is provided in the interior of the cylindrical main body 2 and the interior of the cylindrical main body 2 is separated off by this internal electrode 7 into an upper plasma generating chamber S1 and a lower reaction-treating chamber S2. Moreover, the gas to be introduced in the plasma-generating chamber shall be mixed gas of at least either of hexafluoroethane gas, trifluoromethane gas and oxygen gas. By this constitution, the damage to be given to the substrate is lessened, and at the same time, the treating time can be reduced.
申请公布号 JPS61267325(A) 申请公布日期 1986.11.26
申请号 JP19850109902 申请日期 1985.05.22
申请人 TOKYO DENSHI KAGAKU KK 发明人 HIJIKATA ISAMU;UEHARA AKIRA
分类号 H01L21/30;H01L21/027;H01L21/302;H01L21/3065 主分类号 H01L21/30
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