发明名称 |
Multi-layer electrical support substrate |
摘要 |
To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm. |
申请公布号 |
US4625228(A) |
申请公布日期 |
1986.11.25 |
申请号 |
US19840661934 |
申请日期 |
1984.10.17 |
申请人 |
W.C. HERAEUS GMBH |
发明人 |
BISCHOFF, ALBRECHT;EISENTRAUT, HOLGER;SCHMIDT, JOACHIM |
分类号 |
C23C24/06;H01B1/02;H01L23/495;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
C23C24/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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