发明名称 Multi-layer electrical support substrate
摘要 To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm.
申请公布号 US4625228(A) 申请公布日期 1986.11.25
申请号 US19840661934 申请日期 1984.10.17
申请人 W.C. HERAEUS GMBH 发明人 BISCHOFF, ALBRECHT;EISENTRAUT, HOLGER;SCHMIDT, JOACHIM
分类号 C23C24/06;H01B1/02;H01L23/495;H01L23/50;(IPC1-7):H01L23/48 主分类号 C23C24/06
代理机构 代理人
主权项
地址