| 摘要 |
<p>PURPOSE:To simplify the chute of a semiconductor manufacturing apparatus and the configuration of a metal and to reduce the causes of the faults of the manufacturing apparatus, by making the external size of a heat radiating fin in a semiconductor element with a radiating fin equal to the external size of a main body. CONSTITUTION:A heat radiating fin 6 has a recess part 6a, which is engaged with a protruded part 5a of a main body 5 of a semiconductor element. The fin 6 is coupled with the main body 5 and fixed. The external size of the plane of the fin 6 agrees with the external size of the plane of the main body 5. In the semiconductor element with the heat radiating fin in this constitution, there is no part, which is protruded from the main body 5. Therefore, the chute of semiconductor manufacturing apparatus and the configurations of metal molds and the like can be simplified. The causes of the faults of the manufacturing apparatus can be also reduced. Furthermore, the mounting area can be reduced.</p> |
