| 摘要 |
PURPOSE:To enable a solder mask developable with an inflammable developing soln., superior in resolution and heat resistance and high in reliability to be formed by incorporating a specified photopolymerizable unsatd. compound. CONSTITUTION:The photopolymerizable unsatd. compound is obtained by reacting isocyanatoethyl methacrylate in an isocyanato equivalent/hydroxyl equivalent ratio of 0.1-1.2, with the secondary hydroxyl group of an unsatd. compd. obtained by additionally reacting unsatd. carboxylic acid in an acid equivalent/epoxy equivalent ratio of 0.1-0.98, with a novolak type epoxy resin selected from a group composed of o-cresol-, phenol-, and halogenated phenol- novolak type epoxy resins. The photosensitive resin compsn. contains said unsatd. compd., a sensitizer or its system to be allowed to produce a free radical by actinic rays, and fine filler particles. The use of this photosensitive resin compsn. permits it to be developed with an inflammable developing soln., such as 1,1,1-trichloroethane, and a solder mask superior in resolution and durability to be formed. |
