| 摘要 |
PURPOSE:To obtain the titled composition for the sealing of semiconductor, having decreased internal stress in the sealing material and excellent heat-shock resistance, reliability in moist state and moldability, by compounding an epoxy resin composition with a specific phenol-modified silicone compound. CONSTITUTION:The objective composition can be produced by (1) reacting (A) an organic silicone compound of formula I (R1 is H, methyl, etc.; R2 is 1-5C alkylene; X is epoxy-containing organic group; Y is functional group containing recurring units and is oxyethylene polymer, oxypropylene polymer, etc.; l, m and n are integer) or a combination of the silicone compound with an organic silicone compound of formula II (o and p are integer) with (B) an organic Si compound of formula III (Z is functional group reactive with epoxy, e.g. mercapto, amino, etc.; R3 is 2-5C alkylene; R4 is methyl or ethyl; q is 0-2) and (C) a phenolic resin and, (2) compounding the resultant phenol-modified silicone compound with an epoxy resin, phenolic resin and inorganic filler.
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