发明名称 MOLDING MOLD
摘要 PURPOSE:To prevent the generation of bubbles in the cavity which will become a manufactured article as well as to contrive improvement in damp-proof properties by a method wherein a subcavity, to be used to release the bubbles which will not become a manufactured article, is provided communicating to the cavity for which resin filling is finished. CONSTITUTION:In the cavity 7 of the molding consisting of a top force 5 and a bottom force 6, a dummy subcavity 13 which will not become a manufactured article is provided in a interconnecting manner on the part where the branched flows of resin join together as shown by an arrow in the diagram, i.e., on the side wall of the cavity 7 located at the part opposing to a gate 10. The resin containing air located at the resin junction part of the cavity 7 is released to the cavity 13. As a result, bubbles 12 are transferred to the subcavity 13, and no bubbles are generated in the cavity 7 which will be formed with the manufactured article.
申请公布号 JPS60182141(A) 申请公布日期 1985.09.17
申请号 JP19840036031 申请日期 1984.02.29
申请人 HITACHI SEISAKUSHO KK 发明人 KON NORIO;IKEDA MAMORU;SATOU NOBUSACHI
分类号 H01L21/56;B29C45/26;B29C45/34;B29K105/20;B29L31/34 主分类号 H01L21/56
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