| 摘要 |
<p>PURPOSE:The titled resin decreased in void formation, obtained by heating at least one of the organic components of a semiconductor sealing material in vacuum. CONSTITUTION:The titled resin is obtained by heating at least one of the organic components of a semiconductor sealing material, such as an epoxy resin, a phenolic resin as a curing agent, a catalyst, a mold release, etc., at 100-150 deg.C in a vacuum <=10mmHg for several hr mixing this component with, optionally, an inorganic substance such as a silicon powder or a colorant (e.g., carbon).</p> |
