| 摘要 |
PURPOSE:To ensure improved work efficiency and more accurate positioning by a method wherein a means is provided, for the positioning of a temperature compensating plate and a lower electrode leadout member, in regions except where the main passage is positioned of the current and heat coming out of the temperature-compensating and the lower electrode leadout member. CONSTITUTION:A lower electrode leadout member 14 includes a ring-shaped protruding portion 14a occupying outer regions, except where the main passage of current and heat is located, and contacting the outer circumference of a temperature compensating plate 11b. Two cutaways are provided in the protruding portion 14a for the accommodation of protrusions 11d. The other surface of a semiconductor pellet 1a not in contact with the temperature-compensating plate 11b has an electrode leadout surface 1c built of Al or the like and capable of ohmic contact. The semiconductor pellet 1a, temperature-compensating plate 1b and the electrode leadout surface 1c constitute a semiconductor element 1. Upper and lower electrode leadout members 2 and 14 are compression-bonded to the two surfaces of the semiconductor element 1. This setup ensures an easy and accurate positioning for a semiconductor element and a lower electrode leadout member. |
