| 摘要 |
<p>PURPOSE:To lower the resistance of heat transmitted over a resin from the surface of a pellet, and the improve the effect of dissipation of the surface of the pellet by attaching a metallic film having large thermal conductivity onto the surface of the pellet. CONSTITUTION:In a semiconductor device in which a semiconductor pellet is coated with a resin, the surface except an electrode pad section for the semiconductor pellet is coated with an insulating film, and a metallic film having large thermal conductivity is formed onto the insulating film. A film such as a passivation film 2 is shaped onto the semiconductor pellet 1 fixed to a part such as an island 4, and the metallic film 3 for enhancing the effect of dissipation is attached onto the passivation film 2 through a method such as evaporation. the film thickness of the metallic film 3 is thickened comparatively, and wrinkles are formed to the metallic film 3 by using etching, etc. after evaporation, thus further improving the effect of dissipation. A material having excellent adhesive properties with the passivation film and large thermal conductivity is selected as the quality of material of the metallic film.</p> |
