| 摘要 |
PURPOSE:To rate the performance of a chip only by visually inspecting it from outside by a method wherein the performance of the chip is measured in a wafer check process wherein some or all of the markings, built into the chip simultaneously with the formation of a pattern within the chip, are erased dependently upon the result of the measurement. CONSTITUTION:Simultaneously with the formation of a wiring pattern 1 made for example of Al in a region in each of the chips surrounded by a scribe region 3 in a semiconductor wafer, English letters A, B and C are built of aluminum film into an otherwise useless portion 2 in the chip. In a wafer checking process following the final step of manufacture, the performance is measured of each of the chips. Th performance is categorized for example into A, B, and C. In case of a chip rated to be on the performance level A, the letter A is retained while the letters B and C are erased by laser. In case of a chip rated to be on the performance level B, the letter B is retained and the other two letters are erased, and in case of a chip on the level C, the letter C only is retained. By using this method, the performance of given chip is easily rated on the basis of retained markings. |
