发明名称 High circuit density ICs
摘要 An IC having closely packed rows of cells enables both regular structures (register stacks and memories) and random logic structures to be efficiently fabricated from it. Circuits having more parallel-to-the-length-of-the-rows interconnecting wiring than regular structures have wiring corridors over inactive rows of cells whose cells are not connected into the circuit. A grid power bus structure smooths power flow with a minimum of active device loss by hyphenating "large" cells across the cell-row-crossing conductors.
申请公布号 US4623911(A) 申请公布日期 1986.11.18
申请号 US19830562245 申请日期 1983.12.16
申请人 RCA CORPORATION 发明人 PRYOR, RICHARD L.
分类号 H01L27/118;H03K19/21;(IPC1-7):H01L29/78 主分类号 H01L27/118
代理机构 代理人
主权项
地址
您可能感兴趣的专利