| 摘要 |
PURPOSE:To prevent ink, silicon scraps, metal scraps to scatter in case of putting an improper mark from readhering to the surface of a die of good quality by providing a cylindrical metal gauze on the periphery. CONSTITUTION:Probes 2, 3 provided on a die A and a card substrate 1 of a semiconductor device are contacted to be conducted, and cylindrical metal gauzes 4, 5 are provided around the probes 2, 3, respectively. Foreign materials 6, 7 produced in case of putting an improper mark on the die A are collected by the gauzes 4, 5 provided around the probes 2, 3 to prevent the materials from adhering to the surfaces of the adjacent dies B, C, thereby preventing the semiconductor device from decreasing in the quality. |
