| 摘要 |
PURPOSE:To simplify a sealing structure and to improve the integration of semiconductor elements by opposing two semiconductor elements, and connecting them as part of a sealing wall. CONSTITUTION:A semiconductor device 10 is disposed in a space 22 of a printed substrate 1 with the first semiconductor element 11-1 disposed at the lower side, and the terminals of circuits 23 formed in the prescribed pattern on a substrate 21 and a bump 16 for forming an external connection terminal provided on the second semiconductor element 11-2 are electrically connected. The placing substrate is not limited to the printed substrate, but can use an arbitrary mounting substrate. Such two semiconductor elements are connected with one another and formed as part of a sealing wall to eliminate a die bonding and a wire bonding, thereby simplifying the sealing structure and enhancing the integration of the elements. |
