| 摘要 |
An electrical socket directly interconnects to a semiconductor chip by means of a pressure-fit arrangement. The electrical socket includes a flexible lead carrier (12) with multiple lead terminations thereon, mounted on a rigid substrate (14), with an elastically-deformable layer (16), such as silicone rubber, being situated between the flexible lead carrier and the rigid substrate. As a consequence, the lead terminations on the flexible lead carrier may individually vary in displacement from the rigid substrate to accommodate small variations in the heights of contact terminations on the semiconductor chip. The semiconductor chip is receiving in an opening in a guide member 18. <IMAGE> |
