| 摘要 |
PURPOSE:To easily inspect whether or not IC's defective after a sealing is performed utilizing a non-destructive film thickness meter by a method wherein a defect due to a foam is made to generate in the respective sealing resin itself of some ICs to be decided as defective assembles among IC's. CONSTITUTION:A foaming agent 3 is adhered on a semiconductor chip 2 to be bonded on a lead frame 1. The foaming agent is one which is decomposed by heating like hydrogen carbonate, for example, and generates carbon acid gas. By heating the foaming agent at the time of resin sealing, a foam 5 is generated in a resin 4. If the foaming agent 3 is ready-adhered on some defective assembles only among IC's, a decrease in the thickness of the resin due to the foam 5 can be detected by a well-known non-destructive film thickness meter. As a result, the identification of whether or not the IC's are defective assembles can be easily detected after a sealing is performed. |
