| 摘要 |
PURPOSE:To significantly shorten the length of the lead wires coupling the driving circuit substrate with the measuring instrument and to reduce remarkedly the interference to be caused by the outside noise in an inspection of semiconductors by a method wherein each semiconductor, which becomes the object of inspection, is brought into directly contact with the driving circuit substrate through the socket to be provided on the driving circuit substrate and the driving circuit substrate is mounted just on the measuring instrument. CONSTITUTION:An uninspected work 8 to be escaped on a feeding line 9 is transferred to a socket 13 to be provided on a driving circuit substrate 12 by both of a feeding chuck 10 capable of making the work 8 move vertically and a laterally shifting unit 11 and the work 8 is mounted on the socket 13. The driving circuit substrate 12 is mounted just on a measuring instrument 14. The inspection finished work 8 is transferred on a taking-out rail 16 by a chuck 15 similar to the feeding chuck 10. By this way, an inspection of semiconductors can be conducted in a state that the semiconductors are being mounted on the driving circuit substrate 12, the contact pins and the lead wires between the contact pins and the driving circuit substrate can be omitted and the length of the lead wires coupling the driving circuit substrate with the measuring instrument can be also shortened. As a result, the effect due to the outside noise can be extremely lessensed in the inspection of semiconductors. |
