| 摘要 |
PURPOSE:To decrease the deterioration in the Q0 by bonding a dielectric resonator element to a supporting base by an adhesives and fixing it into a conductor case via the supporting stand so as to decrease the volume of the adhesives and to decrease the dielectric loss. CONSTITUTION:The dielectric resonance element 12 is bonded to the hollow cylindrical supporting base 16 having a diameter smaller than the diameter of the element 12. The base 16 is bonded in the conductor case 20 by the adhesives 18 and the dielectric resonance element 12 is fixed in the case 20 via the adhesives 14, the supporting base 16 and the adhesives 18. The adhesives 14 bonding the element 12 to the supporting base 16 is formed in the dielectric resonator 10 while the adhesives 14 is spread into three positions at the upper end face of the base 16. For example, the adhesives 14 is applied at a center angle 12 deg., applied as a whole to the part of 1/10 of the upper end face of the base 16 and the volume of the adhesives 14 is saved. Thus, the dielectric loss due to the adhesives 14 is less and the deterioration in the Q0 is decreased. |
