| 摘要 |
PURPOSE:To prevent peeling-off, failure, cutting and so forth of the bump electrodes by a method wherein the adhesion area of the elastic body with the mounting substrate is made smaller than the area of the mounting substrate, whereby the stress to be transmitted from the sealing substrate to the mounting substrate through the elastic body is reduced. CONSTITUTION:An elastic body 5 has an elasticity and is constituted of silicone rubber, for example, so that the stress due to the difference in thermal expansibility between a mounting substrate 3 and a sealing substrate 4 is reduced. The elastic body 5 is constituted into a cylindrical configuration in such a way that the adhesion area of the elastic body 5 with the mounting substrate 3 becomes smaller than the area of the mounting substrate 3 and the elastic body 5 is disposed in such a way as to position at the width core part of the mounting substrate 3. That is, the elastic body 5 is constituted in such a way as to suppress from transmitting the stress to generate in the sealing substrate 4 to the whole surface of the mounting substrate 3 and in such a way as to reduce the stress to generate between the mounting substrate 3 and semiconductor chips 1. By this way, the peeling-off, failure, cutting and so forth of bump electrodes 2 can be prevented. |
