| 摘要 |
PURPOSE:To largely eliminate the break and damage of a lead portion by sealing also at the package side of leads with sealing resin except the tips of the leads, and coupling between the leads. CONSTITUTION:After a comblike aluminum wiring model element formed by aluminum depositing mounted on a lead frame is drip coated in advance with a sealing protective material, this element is sealed 1 by transfer molding with an epoxy resin-sealing molding material, and sealed 3 at the package 2 side of the leads with sealing resin, and coupled 4 between the leads to obtain a semiconductor device. Coupling means is provided readily simultaneously with transfer molding by regulating a mold at transfer molding time. |
