| 摘要 |
PURPOSE:To prevent the contact of the edge of a semiconductor chip and an inner lead in a resin sealed type semiconductor device, by bending the tip part of an outer lead, which is connected to the inner lead, toward the side of the inner lead. CONSTITUTION:A bent part 31 is provided in an outer lead 3. Even if an inner lead 4, which connects an electrode 11 of a semiconductor chip 1 and the outer ad 3, comes down, the drooping is suppressed at the bent part 31, and the lead is not contacted with the edge of the chip. |
