| 摘要 |
PURPOSE:To effectively identify a semiconductor device on the basis of a coupling part and a noncoupling part between leads by coupling only a lead gap of the prescribed position at the package side of the leads with a sealing resin except the tips of the leads. CONSTITUTION:After a comblike aluminum wiring model element formed by aluminum depositing mounted on a lead frame is drip coated in advance with a sealing protective material, this element is sealed by transfer molding with an epoxy resin sealing molding material. Lead gaps are alternately coupled at 4 with sealing resin at the package 3 side of the leads 3 except the tips of the leads to obtain a semiconductor device having identifying effect. Coupling means is provided readily simultaneously with transfer molding by regulating a mold at transfer molding time. Sealing and symboling to inform the content of the sealed electronic part are not necessary but can inform by the sealing position of the gap between the leads. Thus, the handling can be readily and automated. |
