| 摘要 |
PURPOSE:To permit the quick soldering of lead parts with good thermal efficiency in the stage of heating the electronic parts on a printed circuit board by hot wind and soldering partially said parts by heating the lead parts of the electronic parts by the hot wind then passing the hot wind on the outside of the electrical parts. CONSTITUTION:Solder paste is coated to the place on the printed circuit board 3 where the electronic part 1 to be soldered is placed. The part 1 is imposed thereon and a guide chip 25 is lowered by an air cylinder 18 until the bottom surface thereof contacts with the part 1. Air is fed into an outside cylinder 14 and is heated to a high temp. by a heater 6 in the inside to form the hot wind which is then diffused and fed to the leads 2 of the part 1 by the chip 25 to melt the solder paste. The dissipation of the hot wind is prevented by an enclosure 27 around the part 1 to improve the thermal efficiency and to melt uniformly the solder paste by which all the leads 2 are quickly soldered. A power source for a heater is thereafter turned off and the cold wind in fed to the electronic part to cool the same. The leads 2 of the electronic part are thus quickly soldered to the printed circuit board 3 with the good thermal efficiency.
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