| 摘要 |
The invention relates to a device for the application of fluxes onto the underneath of workpieces which are to be provided with soldered connections, such as through-plated electrical printed-circuit boards, by means of wave or foam flux nozzles (9) downstream of which in the transportation direction there is arranged a suction device for the flux, which device contains a suction nozzle (1) to which a reduced pressure is applied. Said suction nozzle (1) is connected to an air equalization container, a shutter (8) for varying the air duct cross-section being provided underneath the workpiece, between the flux nozzle (9) and the suction device. The metered flux application which is possible using such a device is intended to be made possible using a device which is convenient in terms of operation and maintenance. To this end, the invention provides that the ratio of the opening cross-section of the suction nozzle (1) to the cross-section of the air equalization container (2) is at least 30:1. The suction nozzle (1) is arranged at right angles to the movement direction of the workpiece. Provided above the air equalization container (2) is a cover (19) in which openings (10) are incorporated at a significant distance from the suction nozzle (1). The air equalization container (2) is connected to a flux separator (3), which consists of a further container (14) with an inlet opening (11) and an outlet opening (12), whose two openings (11, 12) [lacuna] by a partition wall (13) which runs obliquely from top to bottom and in a ... Original abstract incomplete. <IMAGE>
|
