| 摘要 |
Adhesive compositions are commonly used for filling gaps and sealing joints in engineering assembly, but suffer from certain disadvantages. These disadvantages are avoided by adhesive compositions comprising blends of 100 parts by weight of liquid polybutadiene polymer having average molecular weight from 1,000 to 10,000 and viscosity from 2 to 800 dPas at 25 DEG C wherein at least 40 per cent of the unsaturation has a 1,4 configuration, preferably cis 1,4, with 5 to 60 parts of powdered sulphur, 2.5 to 70 parts of an organic accelerator or accelerators and up to 80 per cent by weight of an inert filler or fillers.
<??>In joining or sealing joints, portions of components are coated with the adhesive compositions and the joints are heated to cure the compositions.
<??>Adhesion promoters, dessicants, blowing agents and/or solid rubber, preferably solid polybutadiene, may be included in the compositions. |
