| 摘要 |
PURPOSE:A resin composition suitable for small-sized electronic devices, etc., capable of being made lighter and smaller, having improved reinforcement, dimensional stability and molding properties, obtained by blending aromatic polyamide resin with specific amounts of carbon fibers, glass fibers, etc. CONSTITUTION:(A) 40-80vol% aromatic polyamide resin is blended with (B) 0.1-40vol% carbon fibers having 0.5-0.01m/m length, (C) 0.1-40vol% glass fibers having 0.5-0.01m/m length, (D) 0.1-40vol% inorganic needle-like crystal (e.g., whisker of potassium titanate or silicon carbide) and, (E) 0.01-5vol% zinc stearate. A preferable blending ratio of the components is 55-70vol% component A, 10-30vol% component B, 10-30vol% component C, 5-10vol% component D, and 0.1-1.0vol% component E. |
