ON-MACHINE RETICLE INSPECTION DEVICE

摘要

A device is disclosed for use on a projection type semiconductive wafer precision step-and-repeat alignment and exposure system for on-machine inspection of a reticle containing the circuitry to be printed on the wafer. Two apertured optical detectors are aligned with identical portions of the projected image of the reticle and scanned across the image of the reticle. Any difference in the electrical response of the two optical detectors indicates dirt or a flaw in the reticle.