发明名称 MANUFACTURE OF WIRING SUBSTRATE FOR PHOTOELECTRIC TRANSFER DEVICE
摘要 PURPOSE:To ensure a sufficient electrical conductivity, to form a gold-plated layer only in an opening portion of an insulating film of photosensitive resin and to manufacture a wiring substrate easily, by constructing an electrode wiring portion of two layers of an evaporation film of metal chrome and a metal nickel film. CONSTITUTION:A metal chrome film 9 for an electrode/a wiring is formed by evaporation on an insulating substrate 1 and, a light-receiving portion on this film 9 being masked with a resist pattern 15, a metal nickel film 10 for an electrode/a wiring is deposited on the film 9. Next, after the pattern 15 is removed, a resist pattern 14 is applied by coating, and only a portion to be plated with gold is exposed and developed to form an opening portion 12 on the layer 10. A gold-plated portion 13 is formed in this opening portion 12 by electrolytic gold plating. Thus, an electrode wiring portion of a wiring substrate for a photoelectric transfer device is constructed of two layers of the metal chrome film and the metal nickel film. Thereby a sufficient electrical conductivity is ensured, a gold-plated layer is formed only in the opening portion of the insulating film of photosensitive resin, and thus the quantity of gold to be used is reduced.
申请公布号 JPS61255061(A) 申请公布日期 1986.11.12
申请号 JP19850096959 申请日期 1985.05.08
申请人 TOPPAN PRINTING CO LTD 发明人 YAMADA SENHIKO;FUJINO HITOSHI;ARISAWA MAKOTO
分类号 H05K3/24;H01L27/146;H04N1/028;H05K1/09;H05K3/06 主分类号 H05K3/24
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