发明名称 APPARATUS AND METHOD FOR PROCESSING WAFER IN VACUUM PROCESS AND PROCESSOR
摘要 PURPOSE:To produce a wafer holder for vacuumizing easily fixing and removing the wafer with intensive adsorptive force by a method wherein the holder formed of an organic insulator is constituted on electrodes alternately arranged on an insulating substrate. CONSTITUTION:Positive and negative electrodes 18 are alternately arranged on a ceramic substrate 17 to be covered with an SiO2 thin film 19. A wafer 20 is fixed to a stay 21 on a wafer holder 15 and a base 16 is rotated by an etching angle changing mechanism 22 to turn the holder 15 downward. With the electrode 18 of holder 15 turned ON, the wafer 20 is adsorptively fixed on the holder 15. Next the holder 15 is turned ON and after turning the holder 15 on an ion source 14 and highly vacuumizing a chamber 11 for etching process, the wafer 20 is turned upward turning the power supply of electrode 18 OFF and the stay 21 is released to take out the wafer 20. In such a constitution, the wafer 20 can be fixed and removed while being adsorbed securely to be processed in vacuum.
申请公布号 JPS61255026(A) 申请公布日期 1986.11.12
申请号 JP19850095920 申请日期 1985.05.08
申请人 HITACHI LTD;HITACHI DEVICE ENG CO LTD;HITACHI MICRO COMPUT ENG LTD 发明人 MAEDA TOSHIO;EDA AKIRA;NISHIDA HIDEKI
分类号 H01L21/683;H01L21/302;H01L21/3065;H01L21/67 主分类号 H01L21/683
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