发明名称 HIGHLY INTEGRATED LSI SUBSTRATE
摘要 <p>PURPOSE:To improve the production yield while cutting down the man-hours by a method wherein specific shape parts are provided only on the clock wirings among various wirings. CONSTITUTION:A substrate is composed of an LSI substrate 2 containing a signal layer 3 and LSIs mounted on the LSI substrate 2. The multiple LSIs 1 are mounted on the LSI subtrate 2 to be electrically connected to one another by conductive patterns on surface layer and inner layers. The conductive patterns on the surface layer and inner layers are composed of general signal wirings 4, clock wirings 5 and power supply wiring while the general signal wirings 4 and clock wirings 5 are wired on the same layer. On the other hand, specific shape parts 6 (e.g. round or rectangular parts) are provided only on a part of the clock wirings 5 to discriminate the wirings 5 from the general signal wirings 4. Through these procedures, in the production process of the signal layers 3, attention must be paid only to the clock wirings 5 with specific shape parts 6 as masks to repair the disconnection and short circuit thereof.</p>
申请公布号 JPS61253837(A) 申请公布日期 1986.11.11
申请号 JP19850094915 申请日期 1985.05.02
申请人 NEC CORP 发明人 TAJIMA TSUNEAKI
分类号 H01L23/52;H01L23/12;H01L23/538;H05K3/46 主分类号 H01L23/52
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