| 摘要 |
A solderable metal layer is chemically deposited as an electrical contact on a solid-electrolyte capacitor by replacing the conventional silver contact layer of the capacitor with a layer of colloidal carbon containing a metal which is more electropositive than the solderable metal to be deposited, and thereafter contacting the assembly with a salt solution of the solderable metal. The metal of the salt solution is chemically replaced by the more electropositive metal so that the solderable metal plates out on the carbon surface to form the desired solderable contact layer. The salt solution is preferably a copper or nickel salt solution, and the more electropositive metal is preferably iron.
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