发明名称 HERMETIC SEAL
摘要 PURPOSE:To enable to hermetically-seal a stem and a cap subject to stable and wide range of weldability by a method wherein Au is substituted for Ni as for the plating metal of a weld. CONSTITUTION:Part A inn the figure represents a weld when a stem 1 and a cap are hermetically-sealed while a device normally sealed thereby is composed of a chip 3 formed of a fine electrode and a wiring 4. The surface of welded stem 1 is plated with Au preferably exceeding 0.05mum in thickness. Through these procedures, the range of excellent weldability can be extended 2.5 times compares with the conventional range.
申请公布号 JPS61253836(A) 申请公布日期 1986.11.11
申请号 JP19850095456 申请日期 1985.05.07
申请人 HITACHI LTD 发明人 OGAWA SEIICHI;ASHIDA SAKICHI;ODA KOJI;SAKIYAMA KAZUYUKI;WAKAMORI SATOSHI
分类号 H03H9/25;H01L23/10;H03H3/08 主分类号 H03H9/25
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