发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To make roughly equal the resin wall thickness on the surface side of the pellet with that on the bask surface side of the pellet and to prevent the generation of a warpage of the package, which occurs along with a difference between the resin wall thicknesses due to thermal expansion. CONSTITUTION:A recessed part 10 is provided on the back surface side of a pellet 4, that is, in the surface 9b of a package 9 on the side of a tube 3. The recessed part 10 is formed in a planar quadrangular configuration and is in almost the same configuration as that of the pellet 4. Accordingly, in the part, wherein the pellet 4 is embedded, that is, in the resin wall thickness of an island part 6, the resin wall thickness C on the surface side of the pellet 4 and the resin wall thickness D on the back surface side of the pellet 4 become roughly equal to each other by centering around the island part 6. By such a way, the resin wall thicknesses in the upper and lower directions are nearly equal by centering around inner leads 2 or the island part 6 in whatever parts in the sectional width direction of the package 9. As a result, a warpage is never generated in the package 9 even when the package 9 is taken out of the metal mold and is cooled.</p>
申请公布号 JPS61253840(A) 申请公布日期 1986.11.11
申请号 JP19850095480 申请日期 1985.05.07
申请人 HITACHI LTD 发明人 KIKUCHI IWAO;SUZUKI AKIRA
分类号 H01L23/28;H01L23/31 主分类号 H01L23/28
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