发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To suppress it for the molding resin to spew between the mutually adjoining leads by a method wherein each tie bar is provided with a protrusion between leads. CONSTITUTION:A protrusion 6 is made to protrude from each tie bar 3 in such a way that the region; which is surrounded with resin molded border lines 4, mutually adjoining fellow leads 2 and the tie bar 3; is filled. When a resin sealing is performed, the molding resin spews into the open space between the mutually adjoining leads 2 from the gap between the top and bottom forces for sealing, but the spewing of the molding resin nis suppressed because the open space is being filled with the protrusion 6 made to protrude from the tie bar. Accordingly, the damage of the cutting blade due to the spewed resin, which is seen in the conventional way, is eliminated at the time of cutting of the tie bars and the tie bars can be easily cut. Moreover, the removal work of the spewed resin also becomes unnecessary. As a result, the effect of manhour reduction can be also obtained at the same time.
申请公布号 JPS61253844(A) 申请公布日期 1986.11.11
申请号 JP19850094927 申请日期 1985.05.02
申请人 NEC KYUSHU LTD 发明人 KUBO HIROSHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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