| 发明名称 |
Semiconductor chip with recessed bond pads |
| 摘要 |
A semiconductor chip having bond pads formed on a peripheral ledge recessed below the active chip surface. Ultrasonic wire bonds are made with the pads to lie below the active chip surface.
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| 申请公布号 |
US4622574(A) |
申请公布日期 |
1986.11.11 |
| 申请号 |
US19850759728 |
申请日期 |
1985.07.29 |
| 申请人 |
THE PERKIN-ELMER CORPORATION |
发明人 |
GARCIA, ENRIQUE |
| 分类号 |
H01L21/60;G01R29/24;H01L23/485;(IPC1-7):H01L29/06;H01L21/08 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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