| 摘要 |
An apparatus and method for noncontact and nondestructive test of a photodiode array are given. Such apparatus comprises a Surface Acoustic Wave (SAW) device having one or more sets of interdigital finger pairs placed on each end of the device, separated by slotted waveguide which confines the SAW test probe test signal to a row of diodes to be tested and which is positioned immediately above the waveguide. The SAW device is coupled to signal processing electronics from which individual detector properties, such as the zero voltage bias resistance of each detector, may be calculated.
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