| 摘要 |
<p>IMPROVEMENTS IN ELECTRON GUN PROCESS AND EQUIPMENT FOR VACUUM DEPOSITION This invention relates more particularly to electron gun equipment for lead to tin deposition upon integrated circuit chips. Such equipment (10) is based on a vacuum evaporation principle by means of an electron gun, and it includes: a vacuum chamber (11); a rotatively moving large capacity wafer carrier dome (16); a crucible (15) comprised of a tantalum V-shaped liner (18) slightly spaced apart from a copper pot (19); an electron gun (12) the beam of which (13) is focused on to the center of the material to be evaporated; namely a Pb-Sn load. It is, in addition, comprised of an ion collector gauge (17) which, in this case, is used as a detector when lead stops being evaporated; and a removable shield (21) arranged between the crucible and the wafers during lead evaporation and which is removed during tin evaporation.</p> |
